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Sigrity provides tools for power and signal integrity providing electrical analysis of integrated circuit (IC) packages and printed circuit boards (PCBs).
decoupling capacitance  high-speed analysis HSPICE simulation package analysis post-layout analysis PowerSI pre-layout analysis simultaneous switching output SPEED2000
www.sigrity.com - 2009-02-06
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3D packaging ball grid array, chip scale packaging, semiconductor packaging, multi-chip package, package stacking, system level integration. broadpak produces ...
cavity down memory stacking multi chip package substrate design
www.broadpak.com - 2009-02-11
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A technology visionary and industry pioneer, Teklatech provides targeted EDA solutions for advanced system-on-chip design
design-for-manufacturability dynamic ir drop Floordirector power shaping Teklatech
www.teklatech.com - 2009-02-09
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OEA is an industry leader in 3D extraction of interconnects
3D RCL extraction 3D RCLK extraction clock skew
www.oea.com - 2009-02-05
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